Modular electronic box thermal verification successful
A modular electronic box has been developed for an RTU concept in cooperation with FH Aachen (University of Applied Sciences). The design has been thermally optimized to transfer heat from electronic chips to the baseplate. By thermal tests in Aachen, a correlation has been carried out for analytical models. An ideal coefficient for thermal filler has been identified and an approximate number of 10 modules can be stacked horizontally in order to keep the limitation of 4 K gradient between each frame. The box has been tested in both vertical and horizontal configuration, whereas the vertical version shows better conductivity due to geometrically better conductivity to baseplate. Next steps are structural optimization and vibration testing.